IC test board for Infineon

Easca specializes in PCBA prototype assembly and small-to-medium batch production. We offer Semiconductor Test Board manufacturing, IC Validation Board fabrication, and Power Semiconductor Test Board assembly. Our Semiconductor Test Board solutions support high-precision testing. Our IC Validation Board ensures reliable IC verification. Our Power Semiconductor Test Board handles high-voltage applications. We also provide Semiconductor Test Board for wafer-level testing, IC Validation Board for prototype validation, and Power Semiconductor Test Board for power modules. With SMT, DIP, testing, PCB production, and stencil services, Easca delivers quality for medical, military, industrial, communication, and civil sectors.

Easca PCBA Processing Core Processes

SMT Chip Mounting (Surface Mount Technology)

Solder Paste Printing: fabricate stepped stencils, large-size stencils, and other precision stencils to accurately print solder paste onto PCB pads via stencils.

Component Placement: Equipped with 6 YAMAHA high-speed placement lines, canachieve a daily output of over 15 million points.

Reflow Soldering: 10-zone reflow soldering equipment

DIP Insertion (Through-Hole Technology)

1. Large-size components (e.g., electrolytic capacitors, connectors) are installed manually or via automatic insertion machines.
2. Wave Soldering: selective wave soldering machines and conventional wave soldering pots.

Testing and Inspection:Visual Inspection,AOI,SPI,ICT,FCT,Aging Test

Material Management

1. The customer’s original BOM is 100% cross-checked twice by two personnel to avoid wrong material usage and reverse polarity issues.
2. Components stored in a moisture-proof environment (humidity < 30%).
3. Solder paste in accordance with the IPC-J-STD-004 standard to prevent oxidation and failure