FR4 rigid pcb assembly for audio devices

Easca is committed to PCBA prototype assembly as well as small-to-medium batch SMT chip mounting, DIP insertion, post-welding, testing, and assembly, along with PCB production andSMT precision stencilfabrication. We provide full-set PCBA processing services that meet the requirements of high precision, high difficulty, and superior quality! Our main PCBA product sectors include: medical, military, industrial, communication, and civil applications.

Easca PCBA Processing Core Processes

SMT Chip Mounting (Surface Mount Technology)

Solder Paste Printing: fabricate stepped stencils, large-size stencils, and other precision stencils to accurately print solder paste onto PCB pads via stencils.

Component Placement: Equipped with 6 YAMAHA high-speed placement lines, canachieve a daily output of over 15 million points.

Reflow Soldering: 10-zone reflow soldering equipment

DIP Insertion (Through-Hole Technology)

1. Large-size components (e.g., electrolytic capacitors, connectors) are installed manually or via automatic insertion machines.
2. Wave Soldering: selective wave soldering machines and conventional wave soldering pots.

Testing and Inspection:Visual Inspection,AOI,SPI,ICT,FCT,Aging Test

Material Management

1. The customer’s original BOM is 100% cross-checked twice by two personnel to avoid wrong material usage and reverse polarity issues.
2. Components stored in a moisture-proof environment (humidity < 30%).
3. Solder paste in accordance with the IPC-J-STD-004 standard to prevent oxidation and failure

Process Optimization

1. All stencils are designed with anti-solder ball features.
2. Large-size sensitive components, such as electrolytic capacitors and relays, are pre-baked before reflow soldering.
3. For PCBs with large-area blank pads or individual pads that will be bonded with components later, protective tape is applied before soldering to prevent scratches or solder adhesion.
4. Control the flux spray volume for wave soldering (usually 0.5-1.5g/dm²).