FR4 rigid pcb assembly for audio devices

Easca provides fr4 pcb assembly, audio device pcb assembly and smt pcb assembly for global electronics brands.
Our fr4 pcb assembly covers 0201 components, BGA and QFN, and every fr4 pcb assembly is AOI and X-ray inspected.
As an experienced smt pcb assembly line we run high-speed placement with solder paste inspection, so each smt pcb assembly meets IPC-A-610 Class 2 and 3.
For audio device pcb assembly we handle amplifier boards, DAC modules and Bluetooth audio pcba with low-noise layout.
Applications: fr4 pcb assembly for industrial controls, audio device pcb assembly for speakers and headphones, smt pcb assembly for consumer electronics.
All fr4 pcb assembly, audio device pcb assembly and smt pcb assembly orders are produced in our ISO9001 certified factory.
OEM/ODM: turnkey fr4 pcb assembly, audio device pcb assembly and smt pcb assembly from sourcing to testing.
Contact Easca for quotes and lead times on fr4 pcb assembly, audio device pcb assembly and smt pcb assembly.
See each fr4 pcb assembly, audio device pcb assembly and smt pcb assembly page for capability details.
Samples of fr4 pcb assembly, audio device pcb assembly and smt pcb assembly are available for evaluation.
Our engineering team supports DFM review, panelization and test planning at the quotation stage.

We provide fr4 pcb assembly, audio device pcb assembly and smt pcb assembly with fast turnaround.
Our fr4 pcb assembly, audio device pcb assembly and smt pcb assembly services support low to high volume.
Request a quote for fr4 pcb assembly, audio device pcb assembly and smt pcb assembly today.
 

Easca PCBA Processing Core Processes

SMT Chip Mounting (Surface Mount Technology)

Solder Paste Printing: fabricate stepped stencils, large-size stencils, and other precision stencils to accurately print solder paste onto PCB pads via stencils.

Component Placement: Equipped with 6 YAMAHA high-speed placement lines, canachieve a daily output of over 15 million points.

Reflow Soldering: 10-zone reflow soldering equipment

DIP Insertion (Through-Hole Technology)

1. Large-size components (e.g., electrolytic capacitors, connectors) are installed manually or via automatic insertion machines.
2. Wave Soldering: selective wave soldering machines and conventional wave soldering pots.

Testing and Inspection:Visual Inspection,AOI,SPI,ICT,FCT,Aging Test

Material Management

1. The customer’s original BOM is 100% cross-checked twice by two personnel to avoid wrong material usage and reverse polarity issues.
2. Components stored in a moisture-proof environment (humidity < 30%).
3. Solder paste in accordance with the IPC-J-STD-004 standard to prevent oxidation and failure

Process Optimization

1. All stencils are designed with anti-solder ball features.
2. Large-size sensitive components, such as electrolytic capacitors and relays, are pre-baked before reflow soldering.
3. For PCBs with large-area blank pads or individual pads that will be bonded with components later, protective tape is applied before soldering to prevent scratches or solder adhesion.
4. Control the flux spray volume for wave soldering (usually 0.5-1.5g/dm²).