FPC Assembly for Heating Devices

EH008

2layer FPC, extra large size: 600*300mm, single side SMD, 12um base copper, thin stackup desgined for heating devices

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Leveraging over a decade of expertise in Flexible Printed Circuits (FPC) and rigid-flex PCB technology, Easca provides professional one-stop solutions for Flexible PCB Heating Element Assembly. We offer end-to-end services from customized design of Flexible Heating Circuits, precision FPC fabrication, to complete Medical Heating Pad Assembly and full-process SMT mounting. By integrating the entire workflow from FPC design → PCB manufacturing → material procurement → SMT assembly, we significantly shorten customers' R&D and production cycles. We specialize in delivering stable, reliable, and uniformly heated flexible heating modules, particularly for applications such as medical therapy devices, wearable thermal management products, and specialized industrial heating systems.

Item		Process Capability
Processing Size (Min/Max) (mm)		5050 / 500500
Production Board Thickness (mm)		0.2–4
SPI	Volume Repeatability	<1% at 3σ
Placement	Component Size	0201 (Option) 75mm connector
	Pitch (mm)	0.15
	Repeatability (mm)	±0.01
AOI	FOV Size (mm)	610*450
	Testing Speed (mm²/Sec)	9150
3D X-ray	Imaging Angle (degrees)	0–45
	Position Repeatability (mm)	±0.5

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Easca PCBA Processing Core Processes

SMT Chip Mounting (Surface Mount Technology)

Solder Paste Printing: fabricate stepped stencils, large-size stencils, and other precision stencils to accurately print solder paste onto PCB pads via stencils.

Component Placement: Equipped with 6 YAMAHA high-speed placement lines, canachieve a daily output of over 15 million points.

Reflow Soldering: 10-zone reflow soldering equipment

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